TD next is the technological division of Telecom Design. Its team is mainly composed of engineers (more than 50%).
TD next is aiming at being one of the European leader of Internet of Things as a technological provider (1st RF Sigfox certified modules) and as a global technological solutions provider (like Cloud on Chip technologyTM, a complete stack solution from the Sigfox certified module to the end-user application).
TD next offers innovative solutions, based on strong strategic partnerships: Sigfox, the 1st Ultra Narrow Band network provider for IoT and Avnet Memec, the largest worldwide electronic component distributor.
TD next is not a simple box mover, but has a recognized experience in electronic designs, RF designs, telecom protocols, certifications, sensors, wireless technologies. This expertise, acquired during more than 15 years of innovative projects developments, gives TD next the credibility to help various businesses, from startups to biggest companies listed on the stock exchange, in developing their IoT projects.
Connect everything with very low consumption thanks to our wide family of Sigfox certified modules and tools (EVB, SDK...)Learn more
Technological stack for Internet of Things from our Sigfox certified modules to our cloud & mobile applications.Learn more
High quality, cost-effective & Time-to-Market pin to pin camera modules (VGA & 5Mp) for Industrial Imaging applicationsLearn more